The fourth International Forum on Technology Innovation and IP Protection (TIIP) and the 2021 International Engineers Conference is scheduled to be held during the 23rd China Hi-Tech Fair (CHTF), which will take place from Nov 17 to 21 at the Shenzhen Convention & Exhibition Center in Guangdong province.

TIIP was initiated by the Technology Innovation Association of Shenzhen Enterprise in 2018, aiming to promote international exchanges and cooperation in technology innovation and IP, and advance their development.

Renowned domestic and foreign IP services institutions and experts have attended the previous forums as well as representatives from international organizations like the International Trademark Association (INTA), the International Association for the Protection of Intellectual Property (AIPPI), and enterprises such as Huawei and JD.com.

This year's forum will focus on topics such as technology innovation, IP, international trade, technology transfer, investment and financing along with innovation and entrepreneurship road shows and salons in the CHTF international exhibition areas.