During the 25th China Hi-Tech Fair (CHTF), which will take place from Nov 15 to 19 in Shenzhen, Guangdong province, the sixth International Forum on Technology Innovation and Intellectual Property Protection (TIIP) and the LES 2023 Asia Pacific Conference will be held to discuss innovation, intellectual property protection and commercialization.

 

They will also jointly explore the development of a positive intellectual property market.

 

TIIP, initiated by the Shenzhen Enterprise Innovation Promotion Association in 2018, has attracted renowned intellectual property service agencies and professionals from multiple countries, representatives of well-known international organizations such as INTA and AIPPI China, as well as representatives from domestic and foreign well-known high-tech companies such as Huawei, Tencent, BOE, Lam Research, NXP, and research institutions such as Shenzhen University.

 

The LES 2023 Asia Pacific Conference and LES China's annual meeting will focus on the theme of "Intellectual Property Promotes Prosperity - New Challenges of Licensing Intellectual Property in the Asia Pacific Region". Representatives of renowned enterprises, research institutions, intellectual property service agencies, law firms, and government departments at home and abroad, including Huawei, TCL, Xiaomi, ZTE, the Hong Kong University of Science and Technology, Singapore International Mediation Center, Avanci, and Sisvel, will deliver speeches on a series of hot topics related to intellectual property protection and participate in an additional discussion session.